SpeedFam is the world leader in high precision flat machining equipment. With a full range of single and double side lapping machines, polishing machines, and fine grinding machines, we can provide the solutions that best meet your needs.
SpeedFam introduces its advanced systems for large size sapphire wafer and various material wafers including SiC, GaN and ultra-thin quartz crystal. Numerically controlled dry chemical planarization system (DCP) realizes fast and stable processing with ultra-precision for the next generation flatness specifications of MEMS and SOI wafers.
In the demanding world of tighter and tighter manufacturing specifications, SpeedFam Corporation can help. Since 1959 we have partnered with our customers to develop new technologies, …
SpeedFam double side machines support lap and polish of large-sized workpieces with carrier sizes from 30 inches to a small workpieces with carrier sizes of 2 inches. SpeedFam provides …
Уул уурхайн зориулалттай бутлуур нь ашигт малтмал, чулуулаг, хүдэр болон бусад хатуу материалыг жижиглэх, буталж боловсруулах зориулалттай машин механизм юм. Уул уурхайд олборлолт хийсний дараа том хэмжээтэй чулуулаг, хүдрийг цаашид боловсруулахын тулд бутлуураар жижиглэдэг бөгөөд энэ нь олборлолтын болон …
YAG laser equipment is used typically for local welding of various metals by converged Nd:YAG (neodymium-doped yttrium aluminum garnet) laser beam. YAG laser operates by laser light produced from optical pumping of YAG crystal. Wide range of applications can be supported by SpeedFam laser equipment lineup from 30W to 600W.
YAG laser equipment is used typically for local welding of various metals by converged Nd:YAG (neodymium-doped yttrium aluminum garnet) laser beam. YAG laser operates by laser light …
SpeedFam is the world leader in high precision flat machining equipment. With a full range of single and double side lapping machines, polishing machines, and fine grinding machines, we …
SpeedFam introduces its advanced systems for large size sapphire wafer and various material wafers including SiC, GaN and ultra-thin quartz crystal. Numerically controlled …
SpeedFam double side machines support lap and polish of large-sized workpieces with carrier sizes from 30 inches to a small workpieces with carrier sizes of 2 inches. SpeedFam provides precision and productivity for a processing agenda compatible to all workpiece variations.
SpeedFam is the comprehensive manufacturer of grinding, lapping and polishing equipment and the consumables with process support for various electronic and mechanical materials
Уул уурхайн зориулалттай бутлуур нь ашигт малтмал, чулуулаг, хүдэр болон бусад хатуу материалыг жижиглэх, буталж боловсруулах зориулалттай машин механизм юм. Уул …
In the demanding world of tighter and tighter manufacturing specifications, SpeedFam Corporation can help. Since 1959 we have partnered with our customers to develop new technologies, refine processes, and produce the highest quality flat machining equipment available.
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SpeedFam USA lapping, grinding, and polishing machine videos. Learn more about SpeedFam machines.